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× IPC-7095C: Design and Assembly Process Implementation for BGAs IPC-7095C: Design and Assembly Process Implementation for BGAs 4704,00 Kč
4704,00 Kč
× Zástupný symbol IPC-7530A: Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes 4928,00 Kč
9856,00 Kč
× Zástupný symbol IPC-7092: Design and Assembly Process Implementation for Embedded Components 4704,00 Kč
4704,00 Kč
× Zástupný symbol IPC-2221B: Generic Standard on Printed Board Design 4928,00 Kč
4928,00 Kč
× Zástupný symbol IPC-5704: Cleanliness Requirements for Unpopulated Printed Boards 2604,00 Kč
2604,00 Kč
× IPC-7527: Requirements for Solder Paste Printing IPC-7527: Requirements for Solder Paste Printing 4536,00 Kč
4536,00 Kč
× IPC-7095C: Design and Assembly Process Implementation for BGAs IPC-7095C: Design and Assembly Process Implementation for BGAs 4752,00 Kč
4752,00 Kč
× IPC-4552 WAM1&2: Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards IPC-4552 WAM1&2: Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards 5752,20 Kč
5752,20 Kč
× IPC-7530A: Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes IPC-7530A: Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes 4704,00 Kč
4704,00 Kč
× Zástupný symbol IPC-SM-817A: General Requirements for Dielectric Surface Mount Adhesives 2604,00 Kč
2604,00 Kč
× IPC-7093: Design and Assembly Process Implementation for Bottom Termination Components IPC-7093: Design and Assembly Process Implementation for Bottom Termination Components 4704,00 Kč
4704,00 Kč
× IPC-HDBK-830A: Guidelines for Design, Selection, and Application of Conformal Coatings IPC-HDBK-830A: Guidelines for Design, Selection, and Application of Conformal Coatings 4521,76 Kč
4521,76 Kč
× Zástupný symbol IPC-4556: Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards 4704,00 Kč
4704,00 Kč
× IPC/JEDEC-9704A: Printed Circuit Assembly Strain Gage Test Guideline IPC/JEDEC-9704A: Printed Circuit Assembly Strain Gage Test Guideline 4788,00 Kč
4788,00 Kč
× IPC-1601A: Printed Board Handling and Storage Guidelines IPC-1601A: Printed Board Handling and Storage Guidelines 2492,00 Kč
2492,00 Kč
× IPC-1601A: Printed Board Handling and Storage Guidelines IPC-1601A: Printed Board Handling and Storage Guidelines 2492,00 Kč
2492,00 Kč
× IPC-6012D: Qualification and Performance Specification for Rigid Printed Boards IPC-6012D: Qualification and Performance Specification for Rigid Printed Boards 4928,00 Kč
4928,00 Kč
× IPC-6012D: Qualification and Performance Specification for Rigid Printed Boards IPC-6012D: Qualification and Performance Specification for Rigid Printed Boards 4704,00 Kč
4704,00 Kč
× TM-650: Test Methods Manual TM-650: Test Methods Manual 14742,00 Kč
14742,00 Kč

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Mezisoučet 97219,96 Kč
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