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× IPC-7095C: Design and Assembly Process Implementation for BGAs IPC-7095C: Design and Assembly Process Implementation for BGAs 4704,00 
4704,00 
× Zástupný symbol IPC-7530A: Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes 4928,00 
4928,00 
× Zástupný symbol IPC-7092: Design and Assembly Process Implementation for Embedded Components 4704,00 
4704,00 
× Zástupný symbol IPC-2221B: Generic Standard on Printed Board Design 4928,00 
4928,00 
× Zástupný symbol IPC-5704: Cleanliness Requirements for Unpopulated Printed Boards 2604,00 
2604,00 
× IPC-7527: Requirements for Solder Paste Printing IPC-7527: Requirements for Solder Paste Printing 4536,00 
4536,00 
× IPC-7095C: Design and Assembly Process Implementation for BGAs IPC-7095C: Design and Assembly Process Implementation for BGAs 4752,00 
4752,00 
× IPC-4552 WAM1&2: Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards IPC-4552 WAM1&2: Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards 5752,20 
5752,20 
× IPC-7530A: Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes IPC-7530A: Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes 4704,00 
4704,00 

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Mezisoučet 41612,20 
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Daň 25,20 
Cena celkem 41757,40 
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