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× IPC-7095C: Design and Assembly Process Implementation for BGAs IPC-7095C: Design and Assembly Process Implementation for BGAs 4704,00 
4704,00 
× IPC-4552 WAM1&2: Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards IPC-4552 WAM1&2: Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards 5752,20 
5752,20 
× IPC-7530A: Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes IPC-7530A: Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes 4704,00 
4704,00 
× Zástupný symbol IPC-4553A: Specification for Immersion Silver Plating for Printed Boards 4704,00 
4704,00 
× IPC-CH-65B: Guidelines for Cleaning of Printed Boards and Assemblies IPC-CH-65B: Guidelines for Cleaning of Printed Boards and Assemblies 4704,00 
4704,00 
× IPC-HDBK-830A: Guidelines for Design, Selection, and Application of Conformal Coatings IPC-HDBK-830A: Guidelines for Design, Selection, and Application of Conformal Coatings 4521,76 
4521,76 
× IPC-1601A: Printed Board Handling and Storage Guidelines IPC-1601A: Printed Board Handling and Storage Guidelines 2492,00 
2492,00 
× Zástupný symbol A-25A: Multipurpose 1 Sided Test Pattern - DOWNLOAD KIT 4172,00 
4172,00 

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Mezisoučet 35753,96 
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Daň 25,20 
Cena celkem 35899,16 
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