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Odstranit položku	Produkt	Cena	Množství	Mezisoučet
×	IPC-7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components	4704,00 Kč	IPC-7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components množství	4704,00 Kč
×	IPC-7527: Requirements for Solder Paste Printing	4536,00 Kč	IPC-7527: Requirements for Solder Paste Printing množství	9072,00 Kč
×	IPC-7095C: Design and Assembly Process Implementation for BGAs	4704,00 Kč	IPC-7095C: Design and Assembly Process Implementation for BGAs množství	4704,00 Kč
×	IPC-4556: Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards	4704,00 Kč	IPC-4556: Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards množství	4704,00 Kč
×	IPC-A-630: Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures	4704,00 Kč	IPC-A-630: Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures množství	4704,00 Kč
×	IPC-6012D: Qualification and Performance Specification for Rigid Printed Boards	4928,00 Kč	IPC-6012D: Qualification and Performance Specification for Rigid Printed Boards množství	4928,00 Kč
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